Nedis COOLP400SI Thermal paste 4g
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Images are illustrative. The product shown may differ from the one offered or include components not part of the product set.
VendorNedis
Product codeCOOLP400SI
Price€15.60
Price (excl. VAT)€12.58
Ships in
2-4 bd
Quantity5+ pcs
Ships quicker
This high-performance CPU thermal paste is designed to provide efficient heat transfer between the processor and the cooling system. With thermal conductivity of 4.63 W/mK, it ensures stable temperatures even under heavy workloads. The paste maintains its properties at temperatures up to 300 °C, making it suitable for high-performance CPUs, GPUs, and other heat-generating components. Its low thermal resistance (< 0.01 °C) improves cooling efficiency, while the 4-gram volume is sufficient for multiple applications. Ideal for both professional and home PC assembly.
Technical Specifications:
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Product type: Thermal paste
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Application: CPU / GPU / electronic components
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Thermal conductivity: 4.63 W/mK
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Thermal resistance: < 0.01 °C
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Operating temperature range: up to 300 °C
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Net weight: 4 g
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Colour: Grey
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Electrical conductivity: Non-conductive
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Consistency: Paste
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Intended use: Desktop and laptop computers
Type:
Thermal paste
Thermal conductivity:
4.63 W/m·K
Product colour:
Silver
Viscosity note:
12500
Specific gravity:
3.15 g/cm³
Operating temperature (T-T):
-30 - 280 °C
Thixotropic Index (TI):
280
Low thermal resistance:
Yes
Width:
116 mm
Depth:
18 mm
Height:
22 mm
Weight:
8 g
Spatula:
Yes
Package width:
185 mm
Package depth:
115 mm
Package height:
20 mm
Package weight:
26 g
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